Experimental and computational investigation of chemical vapor deposition of Cu from Cu amidinate
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Ultrathin CVD Cu Seed Layer Formation Using Copper Oxynitride Deposition and Room Temperature Remote Hydrogen Plasma Reduction
Cu seed layers for future interconnects must have conformal step coverage, smooth surface morphology, and strong adhesion. Conformal deposition had been achieved by chemical vapor deposition CVD , but CVD Cu films have rough surfaces and poor adhesion. In this paper, conformal, smooth, adherent, continuous, and thin 9 nm Cu films were made by CVD. CuON was deposited from a Cu-amidinate precurso...
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